This video shows a variable stiffness material composed of a low-melting-point-alloy (LMPA) microstructure embedded in silicone rubber (PDMS). By passing an electrical current through the LMPA, the rigid LMPA first softens and then melts (47°C), causing the whole device to soften. When the electrical power is cut, the LMPA solidifies, returning the device to the rigid state. This device also possesses inherent resistive strain and state sensing.
This device is fabricated as follows:
1. Create SU8 mold of microchannels using photolithography.
2. Cast one layer of PDMS on the SU8 mold and another on a flat substrate.
3. Unmold the PDMS layers and bond together using oxygen plasma.
4. Fill microchannels with LMPA.
5. Attach electrical leads to LMPA.
Final device dimensions are 1x1x0.2cm.
DOI: 10.1039/C3RA44412K
https://pubs.rsc.org/en/Content/ArticleLanding/2013/RA/c3ra44412k#!divAbstract
Post time: Jun-12-2017