Most work in flexible electronics focuses on organic semiconductors, which are limited in performance and thermal stability compared to conventional silicon-based electronics. Making flexible silicon, requires thin silicon; however cost is high (back-side grinding generates a lot of waste). Alternative methods involve transfer to a plastic substrate, therefore, limited integration density, and use of a higher cost wafer.
Researchers at the KAUST Integrated Nanotechnology lab came up with a simple, novel fabrication process to derive thin (5 micron), mechanically flexible, optically transparent, porous monocrystalline silicon (up to 18 cm2) from a low-cost silicon (100) wafer. FlexSi, as the innovation was named, is usable for flexible membrane and high performance electronics on flexible substrates.
This technology is part of KAUST’s technology commercialization program that seeks to stimulate development and commercial use of KAUST-developed technologies. For more information: https://buff.ly/1irFTSm
Post time: Mar-25-2017