2017 Super Lowest Price SV-628 Acetic Silicone Sealant for Russia Importers

We insist on offering high quality production with good business concept, honest sales and the best and fast service. it will bring you not only the high quality product and huge profit, but the most significant is to occupy the endless market for 2017 Super Lowest Price SV-628 Acetic Silicone Sealant for Russia Importers, Welcoming interested companies to cooperate with us, we look forward to having the opportunity of working with companies around the world for joint growth and mutual success.

Description

It is one- component, moisture curing acetic silicone sealant. It cures fast to form a permanently flexible, waterproof and weather resistant silicone rubber.

Where to use

Widely used in construction, glass assembling and home decoration.SV-628 has good adhesion  to most common building materials e.g. glass, ceramic, tile, wood and fiber glass.

Key Features

1. 100% silicone

2. Easy to apply 

3. Excellent elasticity

4. Excellent adhesion to most common building materials          

5. Outstanding weatherproofing capability

6. Fast Curing

Basic Application

1.All kinds of glass curtain wall weatherproof seal
2.For metal (aluminum) curtain wall, enamel curtain wall weatherproof seal
3.Joint sealing of concrete and metal
4.Roof joint seal

Technical data sheet

Technical data sheet for reference,

Certification

JC/T881-2001 20LM; GB/T14683-2003 20LM.

Color

clear, black, silvery gray, white, brown

Package

300ml in cartridge * 24 per box, 590ml in sausage *20 per box

Shelf life

12 months

Note

If you want the TDS or MSDS or other details, please contact with our sales person.

https://www.sincosilicone.com/
Email: info@sincosilicone.com

Customized
OEM & ODM are welcomed

Application
chemical industry, petroleum industry, medical technique, food industry, sewage-disposal industry, steel industry, semi-conduct industry and so on.

Temporary wafer bonding for thin wafer processing is one of the key technologies of 3D system integration. AIT is proud to add to its wafer processing materials solutions with an innovative family of temporary bonding film and spin coating solutions for temporary bonding of silicon device wafers to carrier wafers using traditional low temperature and low pressure thermo-compression process.

AIT is the first known to provide a film format of its high temperature temporary bonding adhesives for thin wafer processing. Leveraging its expertise of film adhesive manufacturing for semiconductor industry for the last 30+ years, wafer processing adhesive are available from 5 micron to 80 micron for device wafers up to 450mm with and without topography. AIT high temperature capable wafer processing adhesives can all be removed with heat-sliding and solvent assisted release separation process with the adhesive on device and carrier wafers removed without additional cleaning in most applications. The WPA-TL 330 can also be removed with laser assisted process.

AIT temporary bonding wafer processing adhesives are thermally stable to 3200-330°C and compatibility of the bonded compound wafers with standard WLP process equipment and for backside processing of 3DTSV wafers. High integrity in bond strength enables ease in back grinding to a thickness of 50 µm. Other device wafer processing such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and other elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum are built in the thermally and chemically stable novel polymers.

Besides the first to make available film formats of the high temperature wafer processing adhesives, AIT WPA-TS 320 and WPA-TL 330 in comparison to traditional and polyimide based temporary handling solutions, also offers one of the highest temperature and time of processing windows for thin wafer processing as well as ease of removal and cleaning.